Ryosuke Yamamura / 山村 亮介

Recent update / News

Experience

March 2018 - Present R4D, Mercari, Inc.

April 2008 - February 2018 DENSO

Affiliation

Researcher / R4D, Mercari, Inc. 

Collaborative Researcher / Joint research project "Value Exchange Engineering", The University of Tokyo (東京大学インクルーシブ工学連携研究機構価値交換工学 共同研究員)

Collaborative Researcher / xlab (Yasuaki Kakehi Laboratory), The University of Tokyo (東京大学情報学環筧研究室 共同研究員)

Research Interests

In recent years, I have been interested in creating a "soft materials system". I have been working on interfaces, sensors, and wireless power transfer

Project

CHI2020 Interactivity

H. Sato, Y. Seong, R. Yamamura, H. Hayashi, K. Hata, H. Ogata, R. Niiyama, and Y. Kawahara, “Soft yet Strong Inflatable Structures for a Foldable and Portable Mobility,” Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems (CHI EA’20), April, 2020, Hawaii, US, April 2020. https://dl.acm.org/doi/abs/10.1145/3334480.3383147

UIST2020 (Best Demo Award)

R. Niiyama*, H. Sato*, K. Tsujimura, K. Narumi, Y. A. Seong, R. Yamamura, Y. Kakehi, and Y. Kawahara, “poimo: Portable and Inflatable Mobility Devices Customizable for Personal Physical Characteristics,” Proceedings of the 33rd Annual ACM Symposium on User Interface Software and Technology (UIST’20), pp. 912–923, Virtual (previously Minneapolis, US), Oct. 2020 (* Authors contributed equally). https://dl.acm.org/doi/10.1145/3379337.3415894

CHI2021 Interactivity

K. Watanabe, R. Yamamura, and Y. Kakehi, “foamin: A Deformable Sensor for Multi-Modal Inputs Based on Conductive Foam with a Single Wire” Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems (CHI EA’21), May, 2021, Yokohama, Japan, May 2021. https://doi.org/10.1145/3411763.3451547

CHI2022 Interactivity

Rei Sakura, Changyo Han, Keisuke Watanabe, Ryosuke Yamamura, and Yasuaki Kakehi. 2022. Design of 3D-Printed Soft Sensors for Wire Management and Customized Softness. In CHI Conference on Human Factors in Computing Systems Extended Abstracts (CHI EA '22). Association for Computing Machinery, New York, NY, USA, Article 192, 1–5. https://doi.org/10.1145/3491101.3519906

IPSJ2021

林寛将，笹谷拓也，畑勝裕，山村亮介，川原圭博 ，”電動パーソナルモビリティのシェアリング事業に向けた無線充電システムの導入とインセンティブスキームに関する検討，” 情報処理学会全国大会 2021，2T-03, March 2021.

IEEE WPTC2020

H. Hayashi, K. Hata, T. Sasatani, H. Sato, R. Yamamura, Y. Seong, R. Niiyama, and Y. Kawahara, “Effect of Body Materials on Transmission Efficiency and Resonant Frequency in Wirelessly Powered Personal Mobility Devices,” IEEE WPTC 2020, Soul, Korea, Nov. 2020. https://ieeexplore.ieee.org/document/9295533

DICOMO2020

林寛将，笹谷拓也，畑勝裕，山村亮介，川原圭博 ，”電動パーソナルモビリティのシェアリング事業に向けた無線充電システムの導入とインセンティブスキームに関する検討，” 情報処理学会全国大会 2021，2T-03, March 2021.

Value Exchange Engineering


Publications

International Conference / Demo

[1] Rei Sakura, Changyo Han, Yahui Lyu, Keisuke Watanabe, Ryosuke Yamamura, and Yasuaki Kakehi. 2023. LattiSense: A 3D-Printable Resistive Deformation Sensor with Lattice Structures. In Proceedings of the 8th ACM Symposium on Computational Fabrication (SCF '23). Association for Computing Machinery, New York, NY, USA, Article 2, 1–14. https://doi.org/10.1145/3623263.3623361

[2] Rei Sakura, Changyo Han, Yahui Lyu, Keisuke Watanabe, Ryosuke Yamamura, and Yasuaki Kakehi. 2023. Demonstrating LattiSense: A 3D-Printable Resistive Deformation Sensor with Lattice Structures. In Proceedings of the 8th ACM Symposium on Computational Fabrication (SCF '23). Association for Computing Machinery, New York, NY, USA, Article 24, 1–2. https://doi.org/10.1145/3623263.3629161

[3] Hiroki Sato, Ryuma Niiyama, Koya Narumi, Young ah Seong, Keisuke Watanabe, Ryosuke Yamamura, Yasuaki Kakehi, and Yoshihiro Kawahara. 2022. Demonstrating poimo as Inflatable, Inclusive Mobility Devices with a Soft Input Interface. In ACM SIGGRAPH 2022 Emerging Technologies (SIGGRAPH '22). Association for Computing Machinery, New York, NY, USA, Article 2, 1–2. https://doi.org/10.1145/3532721.3544020

[4] Rei Sakura, Changyo Han, Keisuke Watanabe, Ryosuke Yamamura, and Yasuaki Kakehi. 2022. Design of 3D-Printed Soft Sensors for Wire Management and Customized Softness. In CHI Conference on Human Factors in Computing Systems Extended Abstracts (CHI EA '22). Association for Computing Machinery, New York, NY, USA, Article 192, 1–5. https://doi.org/10.1145/3491101.3519906

[5] K. Watanabe, R. Yamamura, and Y. Kakehi, “foamin: A Deformable Sensor for Multi-Modal Inputs Based on Conductive Foam with a Single Wire” Extended Abstracts of the 2021 CHI Conference on Human Factors in Computing Systems (CHI EA’21), May, 2021, Yokohama, Japan, May 2021. https://doi.org/10.1145/3411763.3451547

[6] H. Hayashi, K. Hata, T. Sasatani, H. Sato, R. Yamamura, Y. Seong, R. Niiyama, and Y. Kawahara, “Effect of Body Materials on Transmission Efficiency and Resonant Frequency in Wirelessly Powered Personal Mobility Devices,” IEEE WPTC 2020, Soul, Korea, Nov. 2020. https://ieeexplore.ieee.org/document/9295533

[7] R. Niiyama*, H. Sato*, K. Tsujimura, K. Narumi, Y. A. Seong, R. Yamamura, Y. Kakehi, and Y. Kawahara, “poimo: Portable and Inflatable Mobility Devices Customizable for Personal Physical Characteristics,” Proceedings of the 33rd Annual ACM Symposium on User Interface Software and Technology (UIST’20), pp. 912–923, Virtual (previously Minneapolis, US), Oct. 2020 (* Authors contributed equally). https://dl.acm.org/doi/10.1145/3379337.3415894

[8] H. Sato, Y. Seong, R. Yamamura, H. Hayashi, K. Hata, H. Ogata, R. Niiyama, and Y. Kawahara, “Soft yet Strong Inflatable Structures for a Foldable and Portable Mobility,” Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems (CHI EA’20), April, 2020, Hawaii, US, April 2020. https://dl.acm.org/doi/abs/10.1145/3334480.3383147


Domestic Conference / Demo

[1] 林寛将，笹谷拓也，畑勝裕，山村亮介，川原圭博 ，”電動パーソナルモビリティのシェアリング事業に向けた無線充電システムの導入とインセンティブスキームに関する検討，” 情報処理学会全国大会 2021，2T-03, March 2021.

[2] 林寛将，笹谷拓也，畑勝裕，山村亮介，川原圭博，”電動パーソナルモビリティのシェアリング事業に向けた無線充電システムのシミュレーションによる解析，” マルチメディア，分散，協調とモバイル (DICOMO2020) シンポジウム，4A-2, pp.520-525, June 2020.

Award

[1] DIGITAL CONTENT EXPO 2021 SIGGRAPH Special Prize

東京大学大学院 情報理工学系研究科 新山研究室 /東京大学大学院 工学系研究科 川原研究室 / mercari R4D 

[2] DIGITAL CONTENT EXPO 2021 DCAJ会長賞

東京大学大学院 情報理工学系研究科 新山研究室 /東京大学大学院 工学系研究科 川原研究室 / mercari R4D 

[3] DIGITAL CONTENT EXPO 2021 Innovative Technologies 2021 Special Prize – Future Mobility –

東京大学大学院 情報理工学系研究科 新山研究室 /東京大学大学院 工学系研究科 川原研究室 / mercari R4D 

[4] UIST'20 Best Demo Award

R. Niiyama, H. Sato, K. Tsujimura, K. Narumi, Y. a. Seong, R. Yamamura, Y. Kakehi, and Y. Kawahara. 2020. poimo: Portable and Inflatable Mobility Devices Customizable for Personal Physical Characteristics. In Proceedings of the 33rd Annual ACM Symposium on User Interface Software and Technology (UIST ’20). July 23, 2020.

[5] 林寛将，川原圭博，山村亮介，佐藤宏樹，對尾健二，新山龍馬，笹谷拓也，坂井珠麗亜，” 無線給電で支援するパーソナルモビリティのシェアリングサービス，” 「ヨコスカxスマートモビリティ・チャレンジ、ビジネスアイデアコンテスト2019」（スカモビ）Jan.24, 2019 (グランプリ受賞).

Selected Media

Exhibition